The HDI process is a high-density interconnection technology used to manufacture high-performance and high-density printed circuit boards (PCBs). HDI technology achieves more compact and complex circuit layouts by increasing the number of layers, reducing the line widths and spacing, and adopting advanced manufacturing processes.
1) Multilayer design: HDI technology utilizes multilayer circuit board design, which allows more circuit connections to be realized on a smaller area. By increasing the number of layers, the HDI technology provides higher wiring density and more complex circuit structures.
2) Smaller line widths and spacing: HDI technology uses smaller line widths and spacing, enabling more signal lines and power lines to be routed within limited space. This helps reduce circuit board size and weight while improving signal integrity and circuit performance.
3) Blind vias and buried vias: Blind and buried vias are widely used in the HDI process to reduce the length and delay of circuit paths and enhancing the speed and reliability of signal transmission. Blind vias and buried vias also help save space and provide greater design flexibility.
4) Microvia technology: HDI technology also includes microvia technology to achieve smaller vias size and higher connection density. Microvia technology commonly utilizes advanced techniques such as laser drilling or mechanical drilling to realize the manufacture of tiny holes.
5) High-speed signal transmission: Since the HDI technology provides shorter circuit paths and lower signal delays, it is suitable for high-speed signal transmission applications, such as high-speed communications, computer networks, and embedded systems.
The implementation of HDI technology requires advanced manufacturing technology and equipment, SCSPCBA can make HDI PCB with any layer interconnection. About the cost and technical details, please feel free to contact us.