Blind and buried vias are two types of vias commonly used in printed circuit board (PCB) designs to provide interconnections between different layers of the board.
Blind vias are vias that connected the outer layer to other inner layers, but they do not extend through the whole board. Blind vias allow for shorter interconnections, reducing signal delays and improving overall performance. They are commonly used when space is limited on the PCB outer layers, or when high-density components require shorter connections.
On the other hand, buried vias are vias that connected inner layers without extending to the outer layers. During the manufacturing process, the vias are drilled and filled with conductive material between the inner layers, without penetrating the outer layers. Buried vias can improve design flexibility and enable more complex multilayer PCB designs, as they free up space on the outer layers for routing traces or placing components.
1) Blind and buried vias' location
2) Blind and buried vias' number and size
3) The layers in which blind vias and buried vias are located
4) Blind and buried vias' specifications
5) PCB layer stack-up
6) Material and process requirements
SCSPCBA is a professional manufacturer of blind and buried vias PCB, working with our engineering team to ensure the manufacturability of your PCB design. We have advanced equipment and technology to provide cost-effective high-density PCBs. About the cost and technical details, please feel free to contact us.